Our well‑trained, customer‑oriented team is ready to serve you around the clock.
Hotline:
+86 21 5080 9877
Mail:
info@saka.com.cn
While deepening its presence in the aerospace sector, SAKA continues to expand the application boundaries of lightweight material machining. Whether it is large‑sized composite blades for the wind power industry or high‑precision aluminum components for the semiconductor industry, SAKA provides complete solutions ranging from process analysis to equipment customization.
Other industry applications
1. Wind power
2. Semiconductors
*For reference only. Actual applications are not limited to those shown.
Typical materials: fiberglass, carbon fiber, balsa wood, honeycomb sandwich
Typical workpieces: wind turbine blades, blade molds, nacelle covers, hub covers
Core capabilities: Ultra-long stroke (up to 50 meters), five-axis linkage surface machining, dry dust removal system
Solution: SAKA provides high-precision, high-efficiency customized five-axis gantry machining centers for milling, drilling, and trimming of wind turbine blades and molds.
Product Application: BC570
Semiconductor industry
Typical materials: aluminum alloy, aluminum-magnesium alloy
Typical workpieces: wafer stage, optical housing, wafer chuck, vacuum chamber
Core capabilities: High-precision positioning (down to the micrometer level), one-time clamping and forming of complex curved surfaces, high-speed cutting
Solution: SAKA offers precision five-axis machining solutions, including the GC series, to meet the extremely high precision and surface quality requirements of core components in semiconductor equipment.
